HITEK Electronic Materials Ltd provides bespoke services to the electronics industry

Telephone: 01724 851678 Site last updated: Monday, Jan 21, 2010

Encapsulation Questionnaire

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* All fields marked are mandatory

Is the Application?
Is the Enviroment?
Total volume of encapsulant to be used in mm³?:
What is the max cure Temperature °C?
What is the max use Temperature °C?
What is the min use Temperature °C?
What is the preferred initial viscosity?
What is the acceptable required cure time?
What are the materials to be encapsulated (please list)?
Does the joint need to be Thermally conductive?
Does the application require high levels of electrical isolation (black epoxies contain carbon black)?
Is fuel/chemical resistance required?
What is the expected life of the unit?
What alternatives have you considered?
How many units are required?
When are they required?
Over what time period?
   
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