HITEK Electronic Materials Ltd provides bespoke services to the electronics industry

 

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Encapsulants

HITEK ELECTRONIC MATERIALS supplies the range of Emerson and Cumings Polymers Encapsulants. These materials include offerings in epoxy, polyurethane, and silicone. The properties of these Encapsulants vary widely in terms of their initial handling characteristics and final cured properties. The application dictates the nature of the final properties and the manufacture generally dictates the initial.

When choosing the encapsulant consider the following. Encapsulant questionnaire

Note also that the choice of a one part material although convenient generally requires chilled storage and elevated cure, whereas using a two-part material allows for a wider range of cure cycles and final properties as the catalysts can be frequently chosen to vary them.

The links below give the most readily available products from Emerson & Cuming. Please consider some of these prior to anything else, as they tend to be the more cost effective solutions. There is a wide range of other materials available however these sometimes come with significant minimum order quantities.

Stycast Selector Chart - current Stycast common products
Catalyst Overview - basic catalyst chart
Thermal Encapsulant materials - list of encapsulants with thermal properties and other items
Liquid polymer tips - some tips on handling liquid polymers
Electrical property definitions - definitions of the electrical properties important in epoxies