HITEK ELECTRONIC MATERIALS supplies the range of Henkel Encapsulants. These materials include offerings in epoxy, polyurethane, and silicone. The properties of these Encapsulants vary widely in terms of their initial handling characteristics and final cured properties. The application dictates the nature of the final properties and the manufacture generally dictates the initial.
When choosing the encapsulant consider the following. Encapsulant questionnaire
What is the max cure Temperature °C?
What is the max use Temperature °C?
What is the min use Temperature °C?
What is the preferred initial viscosity?
What is the acceptable required cure time?
Note also that the choice of a one part material although convenient generally requires chilled storage and elevated cure, whereas using a two-part material allows for a wider range of cure cycles and final properties as the catalysts can be frequently chosen to vary them.