HITEK Electronic Materials Ltd provides bespoke services to the electronics industry

Site last updated: Friday, February 8, 2008

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Electronics Assembly

Resin Systems - Electronic Assembly

Glob Top

Resin Systems - Electronic Assembly

Circuit Attach

Resin Systems - Electronic Assembly

Dam & Fill

Resin Systems - Electronic Assembly

No flow fluxing Underfill

HITEK offers the latest in electronic assembly adhesives from Emerson & Cuming and Ablestik. These products include the well know trade name products of ABLEBOND©, AMICON©, and ABLEFILM© ranges.

Below are some of the selector guides that will help you choose the material which is right for your application.

Alternatively fill in our adhesives questionnaire or contact HITEK Electronic Materials Ltd.

Glob Top Encapsulants
Adhesives and Coatings for passive Components
Automotive Electronics
Handheld Communication and Computing
Security & ID
Wireless Telecommunications Infrastructure

(AMICON is a registered trademark of The Millipore Corporation)

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